Inline System

Inline sputtering system delivers high uptime and uniform thin-film quality in mass production through a fully automated, continuous process.

Specifications

Deposition Type In-Line Horizontal Type
Substrate Size Mass : ~ Gen.5.5
R&D ~ P/P : ~ Gen.2
Evaporation Source Mass : Linear Source
R&D ~ P/P : Parallel Shot by Point Source
Tact Time Mass : 2mins
R&D ~ P/P : 30mins
Thickness Uniformity Organic : ≤± 3%(Organic), ≤± 4%(Metal)
Align Accuracy Mechanical Align : ≤± 150㎛